会议名称(英文)：  2014 27th International Conference on VLSI Design 
所属学科：  计算机应用技术,电子工程 
开始日期：  2014-01-05 
结束日期：  2014-01-09 
所在国家：  印度 
所在城市：      印度 
具体地点：  Mumbai India 
主办单位：  Association for Computing Machinery - ACM VLSI Society of India 
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[ 组织结构 ] 会议主席：  
组织委员会主席：  
程序委员会主席：  
会议嘉宾：  姓名 职务 简介 演讲题目 
 

[ 重要日期 ] 摘要截稿日期：  2013-07-24 

[ 会务组联系方式 ] 联系人：  Nagi Naganathan 
联系电话：  +1 9083918924 
传真：  
E-MAIL：  Nagi.Naganathan@lsi.com 
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会议网站：  http://vlsidesignconference.org/ 
会议背景介绍：  The VLSI and Embedded Systems Conference is a joint conference serving as a forum for researchers and designers to present and discuss current topics in VLSI design, electronic design automation, embedded systems, and enabling technologies. It covers the entire spectrum of activities in the two vital areas of very large scale integration (VLSI) and embedded systems, which underpin the semiconductor industry. Two full days of tutorials will be followed by three days of regular paper sessions, special sessions, and embedded tutorials. In conjuction with this, 5th International Workshop RASDAT will be held on the 9th and 10th January. Industry presentation sessions, panel discussions, design contests, Education forum, students conference and industrial exhibits round off the program. 
征文范围及要求：  Research papers are invited on previously unpublished results in the following categories:

Embedded Systems:
Embedded system hardware/software co-design; Reconfigurable hardware design; Embedded software; Real-time operating systems; Middleware and virtualization; Embedded multi-cores and many-cores; Communications; Encryption, security, compression; Hybrid systems-on-chip; Sensor networks; Programmable devices; Hardware-software co-verification; Embedded system reliability; Embedded applications (automotive, mobile, medical, etc.), platforms, and case studies

Digital Design:
Low-power design; Asynchronous design; Package and board design.

Analog/RF Design :
Low-power design; Analog, mixed-signal, and RF systems; Package and board design.

System-level Design/ESL:
System-level design methodology; Gigascale design methodology; Multicore systems; Processor and memory design; Concurrent interconnect; Networks-on-chip; Defect tolerant architectures.

Logic Synthesis and Physical Design:
Logic synthesis; Technology mapping; Asynchronous synthesis; Physical design; Floor planning; Placement; Routing; Clock Design; Layout issues in design for manufacturability.

Test and Reliability:
Fault modeling/simulation; ATPG; DFT; Delay test; Fault-tolerance; Online test; AMS/RF test; Board-level and system-level test; Silicon debug, post-silicon validation; Memory test; Reliability test.

Functional Verification:
Behavioral Simulation; RTL Simulation; Coverage Driven Verification; Assertion Based Verification; Gate-level simulation; Emulation; Hardware Assisted Verification; Formal Verification; Equivalence Checking; Verification Methodologies.

Device/circuit simulation and modeling:
Design verification; Signal integrity; Technology modeling-design-simulation; Analog/mixed-signal simulation; Multi-domain simulation; Numerical methods; Device modeling; Timing analysis; Asynchronous timing; Device/circuit level variability models; Reliability simulation.

Emerging Technologies:
Issues in nano-CMOS technologies; MEMS; CMOS sensors; CAD/EDA methodologies for nanotechnology; Non-classical CMOS; Post-CMOS devices; Biomedical circuits and systems.