会议名称(中文)：  第十五届电子封装技术国际会议 
会议名称(英文)：  2014 International Conference on Electronic Packaging Technology 
所属学科：  电子工程,半导体技术,材料科学基础学科  
开始日期：  2014-08-12 
结束日期：  2014-08-15 
所在国家：  中华人民共和国 
所在城市：  四川省     成都市  
主办单位：  中国电子学会 
协办单位：  IEEE 
承办单位：  中国电子学会电子制造与封装技术分会,电子科技大学 
议题：  交流电子封装技术领域的最新进展 
 

[ 组织结构 ]
会议主席：  毕克允 
组织委员会主席：  田忠 
程序委员会主席：  杨邦朝 

[ 重要日期 ]
摘要截稿日期：  2014-05-12 
全文截稿日期：  2014-06-30 
论文录用通知日期：  2014-06-02 

[ 会务组联系方式 ]
联系人：  李建 
联系电话：  028-61831119 
传真：  028-61831163 
E-MAIL：  icept2014@vip.163.com 
  
会议网站：  http://www.icept.org  
会议背景介绍：  第十五届电子封装技术国际会议（ICEPT 2014）将于2014年8月12日至15日 在中国成都举行。会议由中国电子学会主办，中国电子学会电子制造与封装技术分会（CIE-EMPT）、电子科技大学承办。ICEPT会议多年来得到了IEEE-CPMT的全力支持和IMAPS、iNEMI等国际行业组织的积极参与，并得到了中国电子学会、中国科协的高度评价，已成为国际电子封装领域四大品牌会议之一，也为来自海内外学术界和工业界的专家、学者和研究人员提供了一个交流电子封装技术新进展、新思路的重要技术平台。
 
征文范围及要求：  CONFERENCE THEMES
(1)Advanced Packaging: BGA, CSP, flip ship; COB WLP, POP/PIP; TSV, 3D integration; high density substrate; and other advanced packaging and integration technologies.
(2)System Integration: 3D integration by TSV, SIP, Test methodologies for 3D packaging and system level packaging.
(3)Packaging Materials & Processes: Green materials, nano-materials, and other novel materials for packaging performance enhancement and cost reduction; various new packaging/assembly processes.
(4)Packaging Design and Modeling: Novel packaging/assembly designs; methodologies for modeling, simulation and validation of electrical, thermal, optical and mechanical performance of various electronics packages; multi-scale and multi-physics modeling, process simulation.
(5)Inter-connection technologies: High density inter-connection technologies; advanced bonding technologies; substrate solution for 3D packaging; non-conventional inter-connection technologies.
(6)Advanced Manufacturing Technologies and Packaging Equipment: Packaging/assembly equipment (wafer thinning); test technologies; technologies for manufacturability and yield improvement, cost reduction and service performance improvement.
(7)Quality & Reliability: Quality monitoring and evaluation; methodologies for accelerated reliability data collection and analysis, reliability modeling and life prediction, failure analysis and non-destructive diagnose.
(8)Solid State Lighting Packaging & Integration: Methodologies for design, manufacturing and test of high power LED module; LED packaging/integration technologies and their applications in LCD, micro-projector, in-door lighting, street lamp, etc.
(9)Microwave and Power electronics Packaging: Components and modules for RF/mmW/THz systems; power devices; microwave device packaging; power electronics packaging; automobile electronics packaging.
(10)Emerging Technologies: MEMS, NEMS, and MOEMS; optoelectronics packaging; medical electronic device packaging; wearable/flexible electronics packing; sensors, actuators, nano-devices, etc.