[ 重要日期 ] 摘要截稿日期： 2013-11-15
全文截稿日期： 2014-01-15
论文录用通知日期： 2014-03-15
[ 会务组联系方式 ] 联系人： Mr. Lei Ye
E-MAIL： brazingbeijing2014@163.com
会议网站： http://www.china-weldnet.com/Fisrt%20Call%20For%20Papers%202014%20International%20Conference%20on%20Brazing,%20Soldering%20and%20Special%20Joining%20Technologies.pdf
会议背景介绍： We are pleased to invite you to attend the 2014 International Conference on Brazing, Soldering and Special Joining Technologies to be held in Beijing, China, from June 9 to 13, 2014.
The conference will bring together international welding experts to share and discuss state-of-the-art researches involving brazing, soldering and special joining technologies.
We look forward to welcoming you at Beijing.
征文范围及要求： The submitted papers are ativlsed but not limited to the following subjects:
Joining of ceramics and ceramic matrix composites (CMCs)
Joining of intermetal lies and superalloys
Micro- and nano- joining technologies
Lead-free solders and electronic packaging technologies
Special joining technologies such as laser brazing, electron-beam brazing, ultrasonic brazing, etc.
Modeling and simulation
Joint reliability evaluation
