会议名称(英文)： 2014 8th International Conference on Integrated Power Electronics Systems (CIPS)
所属学科： 电力电子
开始日期： 2014-02-25
结束日期： 2014-02-27
所在国家： 德国
所在城市： 德国
具体地点： Nurnberg, Germany
主办单位： IEEE Power Electronics Society
[ 重要日期 ] 全文截稿日期： 2013-09-20
[ 会务组联系方式 ] 联系人： Mrs. Hatice Altintas
联系电话： +49 69 6308-477
传真： +49 69 6308-144
E-MAIL： hatice.altintas@vde.com
会议网站： http://conference.vde.com/cips/2014/Pages/welcome.aspx
会议背景介绍： In the next decades, power electronic system development will be driven by energy saving systems, intelligent energy management, power quality, system miniaturization and higher reliability. Monolithic and hybrid system integration will include advanced device concepts (including wide bandgap devices), dedicated ideas for system integration, new ideas on packaging technologies and the overall integration of actuators/drives (mechatronic integration).
CIPS is focussed on the following main aspects:
Packaging Technologies
Hybrid System and High Power Density Integration
Systems and Components Reliability
Mechatronic Integration
Basic technologies for integrated power electronics systems as well as upcoming new important applications will be presented in interdisciplinary invited papers.
The story of CIPS began in 1999 with a Workshop in Frankfurt/Germany regarding System Integration of Power Electronics. The first CIPS conference took place in 2000 in Bremen / Germany.
Today CIPS is an international conference, well known as a technical and scientific forum for engineers coming from industry and academia.
征文范围及要求： Topics
Mechatronic systems
Integration of sensors and actuators
Integration of PE into E-machine
Overall system optimization
Application of integrated PE systems
Inverters and converters
Drivers, monitoring intelligent drivers
Advanced filters
Power modules
Advanced module concepts
3-D-Integration
Intelligent power modules
Internal parasitics and interference problems
Packaging, (general)
System and component packaging
New materials and interconnects
Bare chip packaging
Cooling concepts, reduction of thermal resistance
Assembly concepts
Embedded power
High and low temperature applications
Interface materials
Hermetic packages
Wide bandgap device packaging
Technologies for verhy high temperature
Interference problems of parallel devices
Very high electric field problems
Components
New and integrated active and passive components
Sensors and actuators
Coolers
CD link capacitors
Reliability
Reliability requirements
Application dependent mission profiles
Test methods
Physics of failure
Prognostics and health management
Robustness validation process
Design and Test Tools
Electrical design: Internal parasitic and interferences (EMI)
Thermal design and management
Multi-physics CAD
Physical models for failure mechanisms
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