会议名称(英文): 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) 所属学科: 基础物理学,电子工程,控制系统仿真技术 开始日期: 2014-04-07 结束日期: 2014-04-09 所在国家: 比利时 所在城市: 比利时 具体地点: Marriott Hotel, city centre Belgium 主办单位: IEEE Components, Packaging and Manufacturing Technology Society 全文截稿日期: 2014-02-16 联系人: Olivier de Saint Legerde Saint 联系电话: +33(0)1 3043 6388 E-MAIL: olivier.desaintleger@astefo.com 会议网站: http://www.eurosime.org/ 会议背景介绍: One of the technology trends of the electronics industry is the rapid development and ever-increasing application of advanced simulation methodologies and tools. For the leading global companies, simulation is becoming a daily practice, a standard tool, and an important competitive edge to achieve competitive product and/or process development. Thermal, thermo-mechanical and mechanical simulations have significant impact on the business profitability of electronics industries. On the other hand, the fascinating development of the electronics industry has also formulated many challenges and impulse for the further development of simulation methodologies and tools. As the only international conference specially dedicated to thermal, mechanical and multiphysics simulation and experiments in microelectronics and microsystems, EuroSimE was initiated in 2000 with major sponsorship from the European Community. The 15th in the series, EuroSimE 2014 aims to: promote further development and application of simulation methodologies and tools for the electronics industry, improve communication and exchange information between methodology & tool-developers and industry users, strengthen co-operation between industry, universities, and research institutes.
EuroSimE 2014 will be held in the city of Ghent, Belgium, on April 7-8-9th 2014 with imec as local organiser (B. Vandevelde).
征文范围及要求: EuroSimE addresses the results of both fundamental research and industrial application in the fields of thermal, mechanical and multiphysics simulation and experiments in microelectronics and microsystems. This includes, but is not limited to: mechanical simulation (both static and dynamic), thermo-mechanical simulation, thermal simulation, material characterisation experiments and modelling, thin-film mechanics, failure criteria and damage-modelling (fatigue, creep, delamination, cracks, buckling, large deformation, moisture-induced failures, yield), fracture, continuum, and micro-mechanics in (micro)-electronics, interface strengths, experiments for model verification, simulation in reliability engineering, (micro)-electronic product and/or process optimisation, simulation-based optimisation, simulation for reliability improvement/failure prediction, virtual and accelerated reliability qualification, design rule development via simulation, virtual prototyping in product and/or process design, from micro to macro simulation, multi-physics simulation, advanced numerical and analytical simulation methodologies and tools.
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