会议名称(英文)： 40th International Symposium for Testing and Failure Analysis
所属学科： 分析化学,材料科学基础学科,机械学
开始日期： 2014-11-09
结束日期： 2014-11-13
所在国家： 美国
所在城市： 美国
具体地点： Houston, Texas, USA
主办单位： ASM International
[ 重要日期 ] 摘要截稿日期： 2014-04-07
[ 会务组联系方式 ] 联系人：
联系电话： (440) 338-5151, ext. 0
传真： (440) 338-4634
E-MAIL： memberservicecenter@asminternational.org
会议网站： http://www.asminternational.org/content/Events/istfa/
会议背景介绍： We invite you to submit your work for publication and presentation at the 40th International Symposium for Testing and Failure Analysis (ISTFA 2014) in Houston, Texas, USA.
Product debug, one of the many facets of failure analysis, will receive a renewed focus at ISTFA 2014. Share your work in debugging timing, power and logic issues after tapeout. Today's highly integrated, multiple-core, low power devices that combine IP from several vendors don't always function as simulation predicts. Novel transistors and smaller features sizes create circuit sensitivities that are first discovered in the finished product. What tools and techniques do you use to locate these product issues? How are the findings used to create better simulation models or new revisions? What data must post-silicon validation teams provide to speed the debug process?
Semiconductor failure analysis is a multi-faceted discipline, and ISTFA 2014 will continue leading the exploration of the entire field. Technical sessions, user groups, tutorials, short courses and the largest equipment exposition in the industry make ISTFA the best place to learn about failure analysis, and to network and further your career.
征文范围及要求： We are soliciting original, unpublished and novel material on the following topics:
NEW! Product debug: locating speed limiting or power consuming circuits or logic bugs after tapeout
Fault isolation with photon or beam-based techniques
2D and 3D package or assembly failure analysis
Circuit edit with focused ion beam
Sample preparation and device deprocessing
Case studies that offer a new perspective on failure analysis
Non-commercial papers on new tools and techniques from tool vendors
Testing as it relates to characterization and root cause analysis
Software based techniques for failure analysis
Microscopy, including optical, SEM, TEM and FIB
Unique technology-specific failure analysis challenges for organic electronics, sensors and MEMS, discrete devices and photovoltaics and solid state lighting
Detecting counterfeit devices
System level debug
Yield and reliability enhancement
Novel research-level techniques and concepts for root cause analysis
Semiconductor materials characterization
Unique perspectives on the failure analysis process or lab management
Electrical characterization, nanoprobing and metrology
Competitive analysis techniques and results
|
