期刊缩写 IEEE T COMP PACK MAN
期刊全称 IEEE transactions on components, packaging, and manufacturing technology
期刊ISSN 2156-3950
2012-2013最新影响因子 1.261
期刊官方网站 http://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=5503870
期刊投稿网址
通讯方式
涉及的研究方向 -
出版国家
出版周期
出版年份 2011
年文章数 239
Aims & Scope
IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.
Subjects
Aerospace
Bioengineering
Communication, Networking & Broadcasting
Components, Circuits, Devices & Systems
Computing & Processing (Hardware/Software)
Engineered Materials, Dielectrics & Plasmas
Engineering Profession
Fields, Waves & Electromagnetics
General Topics for Engineers (Math, Science & Engineering)
Geoscience
Nuclear Engineering
Photonics & Electro-Optics
Power, Energy, & Industry Applications
Robotics & Control Systems
Signal Processing & Analysis
Transportation
Co-Editor
Jose E Schutt-Aíne
Electrical Performance of Integrated Systems
University of Illinois at Urban Champaign
Electrical and Computer Engineering
155 Everitt Laboratory, 1406 W. Green St.
Urbana, IL 61801 USA
jschutt@emlab.uiuc.edu
Phone:+1 217 244 7279
Co-Editor
Koneru Ramakrishna
Components: Characterization and Modeling
Austin, TX 78735 USA
rama@ieee.org
Co-Editor
Kuo-Ning Chiang
Packaging Technologies
National Tsing Hua University
Department of Power Mechanical Engineering
No.101, Sec.2, Kuang Fu Road
Hsinchu 300 Taiwan
knchiang@pme.nthu.edu.tw
Phone:886 3 5742925
Co-Editor
R. Wayne Johnson
Electronics Manufacturing
Laboratory for Electronics Packaging and Assembly Electrical and Computer Engineering
Auburn University
162 Broun Hall
Auburn, AL 36849-5201 USA
johnson@eng.auburn.edu
Phone:+ 1 334 844 1880
Co-Editor
Ravi Mahajan
Advanced Packaging
Intel
Pathfinding
5000 W. Chandler Blvd.
Chandler, AZ 85226 USA
ravi.v.mahajan@intel.com
Phone:+1 480 554 3715
Managing Editor
R. Wayne Johnson
Laboratory for Electronics Packaging and Assembly Electrical and Computer Engineering
Auburn University
162 Broun Hall
Auburn, AL 36849-5201 USA
johnson@eng.auburn.edu
Phone:+1 334 844 1880 |
