会议名称(中文)： 2015年第二届传感器和材料制造科学国际会议
会议名称(英文)： The 2nd International Conference on Sensors and Materials Manufacturing Science 2015 (2nd ICSMMS2015)
所属学科： 材料科学基础学科,材料加工与处理
开始日期： 2015-01-17
结束日期： 2015-01-18
所在国家： 法国
所在城市： 法国
具体地点： 巴黎
主办单位： rans Tech Publications
[ 重要日期 ]
全文截稿日期： 2014-11-24
参会报名截止日期： 2014-12-08
[ 会务组联系方式 ]
联系人： Ms. Ji
会议背景介绍： The International Conference on Sensors and Materials Manufacturing Science 2015 (2nd ICSMMS2015) is being organized and will be held on 17-18th January, 2015 in Paris, France.
The 1st International Conference on Sensors and Materials Manufacturing Science 2014 (ICSMMS2014) has been successfully held in Hangzhou, China during April 11-12, 2014.All papers accepted by ICSMMS 2014 have been successfully indexed by EI Compendex three months after the conference.
The ICSMMS2015 is still co-sponsored by Trans tech publications & Bosi EDU (Professional Organizer for Academic Conferences. ICSMMS 2015 will provide an interactive forum for researchers, engineers and vendors from different disciplines to exchange ideas and experience, identify future directions and challenges, and explore collaborative research and system development from all Sensors and Materials Manufacturing Science related areas. This conference will significantly benefit a large variety of audience from both academic and industry, establishing business or research relations for future collaboration.
All accepted paper will be published in the international journal “Applied Mechanics and Materials” [ISSN: 1660-9336, Trans Tech Publications]. “Applied Mechanics and Materials” is indexed by Elsevier. Scopus and Ei Compendex (CPX), Cambridge Scientific Abstracts (CSA) , Chemical Abstracts (CA) , Google and Google Scholar, ISI (ISTP) , Institution of Electrical Engineers(IEE) , etc.(For index information, please refer to AMM official website: http://www.ttp.net/1660-9336.html).
Finally, you are cordially invited and most welcome to participate in ICSMMS 2015.
征文范围及要求： 2nd ICSMMS2015 is now accepting manuscript submissions. Prospective authors are invited to submit their draft paper to cfp@icsmms.org or by Easychair . The submitted paper can be in MS WORD format or PDF format.
CFP: Chinese
English
Topics: (NOTE: Other related topics are also welcome)
T1:Sensor Technology
Nanomaterials and Electrics Technology for Sensors
Semiconductor Materials for Sensors
Polymer Materials for Sensors
Mechanical Sensor
Optical Sensor
Optical Fiber Sensor
Biological, Chemical Sensor
Temperature Sensor
Gas Sensor
Humidity Sensor
Robot Sensor
Other Sensors
Multi Sensor Fusion Technology
Sensor Calibration
Acoustic Sensor
Electromagnetic Sensor
T2: New Materials and Advanced Materials
Non-ferrous Metal material
Iron and Steel
Composites
Micro / Nano Materials
Optical/Electronic/Magnetic Materials
New Functional Materials
Building Materials
New Energy Materials
Environmental Friendly Materials
Earthquake Materials and Design
Biomaterials
Smart/Intelligent Materials/Intelligent Systems
Polymeric Materials
Mechanical Behavior & Fracture
ToolingTesting and Evaluation of Materials
T3: Manufacturing Processes and Systems
Surface Engineering/Coatings
Materials Forming
Materials Machining
Powder Metallurgy
Severe Plastic Deformation
Tribology in Manufacturing Processes
Theory and Application of Friction and Wear
Casting and solidification
Microwave Processing of Materials
Waste-to-Energy, Waste Management and Waste Disposal
Thermal Engineering Theory and Applications
Rapid Prototyping, Manufacturing, and Tooling
E-manufacturing, ERP, and Integrated Factory
Sequencing, and Scheduling
Virtual Manufacturing, and Simulation
Operations, and Production Management
Precision Engineering, and Concurrent Engineering
DSS, ES and AI in Manufacturing
Engineering Optimization
T4:Automation and Equipment Manufacturing
Mechatronics
Industrial Robotics and Automation
Machine Vision
Sensor Technology
Microelectronic Technology
Integrated Circuit Technology
Measure Control Technologies and Intelligent Systems
Transmission and Control of Fluid
Mechanical Control and Information Processing Technology
Embedded System
Advanced Forming Manufacturing and Equipment
NEMS/MEMS Technology and Equipment
Micro-Electronic Packaging Technology and Equipment
Advanced NC Techniques and Equipment
Power and Fluid Machinery
Energy Machinery and Equipment
Construction Machinery and Equipment
T5:Other related topics
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