会议名称(中文)： 2015年平坦化 / CMP技术国际会议
会议名称(英文)： 2015 International Conference on Planarization/CMP Technology (ICPT)
所属学科： 一般力学与力学基础,电子工程,机械学
开始日期： 2015-09-30
结束日期： 2015-10-02
所在国家： 美国
所在城市： 美国
具体地点： Chandler, AZ, USA
主办单位： IEEE Electron Devices Society
会议背景介绍：
ICPT 2015 will be held at the Wild Horse Pass Hotel and Casino located in Chandler, Arizona from September 30-October 2, 2015.
ICPT 2015 is jointly hosted by CMP User’s Group of the Northern California Chapter of the American Vacuum Society and the Clarkson University Center for Advanced Materials Processing (CAMP). The conference will provide an international forum for academic researchers, industrial practitioners and engineers from around the world for the exchange of information on state-of-the-art research in CMP technology. ICPT 2015 promotes the exchange of opportunities, ideas, friendly relationships and research collaboration.
We look forward to seeing you at ICPT 2015 and welcoming you to the beautiful Wild Horse Pass Hotel and Casino in sunny Chandler, Arizona.
征文范围及要求：
Abstracts of original work are requested on the following topics:
Front end and back end CMP applications
Process integration, control & reliability
Consumables, equipment and metrology
Defects and Post CMP cleaning
CMP fundamentals, modeling and simulation
3D ICs/TSV applications
CMP for MEMS
Environmental issues related to CMP
Emerging technologies in CMP
Alternative planarization technologies |
